On June 6th, according to Taiwanese media reports, it was rumored that SpaceX has ventured into the semiconductor packaging field and plans to build its own FOPLP factory in Texas, USA.

The report points out that currently SpaceX's satellite RF chips and PMICs are packaged by STMicroelectronics, and Innolux has also received a portion of the overflow orders. However, SpaceX still plans to strengthen its vertical integration capabilities in the satellite field through its own production capacity, achieve more precise control over various components of the satellite system, and reduce costs and increase efficiency at the packaging end.

It is reported that SpaceX's FOPLP package substrate size is the largest in the industry, 700mm × 700mm. While this may increase development difficulty due to greater risk of warping, it also further reduces cost after energy production.

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