On March 19th, NANDFlash manufacturer Kaixia Electronics (China) recently issued a production halt notice to customers, stating that they will cease production of products using Thin Small Form Package (TSOP).

This type of packaging is mainly used for low capacity MLC NAND - flash memory products where each storage unit can store 2 bits of data, which also means that Kaixia's low capacity MLC NAND may exit the market. Kaixia stated that due to limited production capacity and substrate supply, the company is unable to continue producing TSOP packaging products ranging from 8Gb to 64Gb. Notification requires customers to submit their final procurement forecast before May 30, 2026, in order for the company to determine subsequent support plans; The final order deadline is September 15, 2026, and the last shipment is scheduled for March 15, 2027.

At present, it cannot be confirmed whether the discontinuation of TSOP products by Kaixia China is directly related to its overall strategy of reducing MLC supply. However, the industry generally expects that Kaixia's MLC supply is likely to completely return to zero between 2027 and 2028.

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