As competitors such as Intel and Samsung compete to invest in glass substrates, TSMC has significantly accelerated its efforts to promote the industrialization of its own technology. Recently, a news about glass substrates from TSMC has ignited the capital market.

According to the Taiwan Electronic Times, it has been reported that TSMC has recently released the "CoWoS Glass Substrate Development Plan" to the supply chain, confirming its partnership with ABF carrier board manufacturer Ibiden and panel manufacturer Innolux to jointly verify the feasibility of introducing CoWoS advanced packaging into glass substrates, hoping to solve the challenges of large-scale AI chip packaging in areas such as warpage, thermal management, signal transmission, and power supply in the future.

The report also pointed out that although there is still some distance to go before full-scale production, this is TSMC's first public disclosure of the results of jointly verifying glass substrates with Ibiden and Innolux, which also means that glass substrates have officially entered the industrial verification stage.

In fact, the industry is developing towards AI chips with high computing power and ultra large scale packaging, which places extremely high demands on substrate materials. Traditional organic substrates have shortcomings such as large warpage, high high-frequency losses, and insufficient heat dissipation and stability. Glass substrates, with their low thermal expansion coefficient, high flatness, low dielectric loss, and large-scale manufacturing capabilities, have long been regarded by the industry as an important technology route for the next generation of advanced packaging. It is expected to usher in initial mass production and landing in 2027-2028.

Therefore, the technological verification progress of TSMC's glass substrate is of great significance for the market to judge its mass production and import pace. 

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