On June 25th, IBM announced the world's first breakthrough in chip manufacturing technology below 1 nanometer, using a 0.7 nanometer Nanostack three-dimensional stacking architecture, which can integrate nearly 100 billion transistors on nail sized chips, bringing up to 50% performance improvement and 70% energy efficiency improvement, and is expected to have mass production conditions in the next five years.

This achievement marks the official breakthrough of the semiconductor industry beyond the nanoscale limit and enters a new era of atomic scale scaling. Affected by this news, IBM rose sharply before the market, now up nearly 7%.

The breakthrough is supported by IBM's new "Nanostack" transistor architecture. Unlike traditional planar arrangement, this scheme adopts a three-dimensional vertical stacking design to accommodate more transistors in the same area and improve chip integration.

IBM Research Institute President and IBM Fellow Jay Gambetta said, "IBM's latest chip breakthrough is an important milestone in the field of computing, driving technology beyond the nanoscale and into the atomic scale. NanoStack not only makes transistors smaller, but fundamentally redesigns chip structures to significantly improve computing power and energy efficiency. This industry innovation continues IBM's tradition of leading the development of next-generation technologies and lays the foundation for the next era of computing. ”

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